The UltraMap UMA-300-WL full automation including robotic loading and 6 cassettes for binning.A convenient benchtop version, the UltraMap UMS-300WL, is also available.This model is designed for the measurement of high speed wafer measurement of wafer production plant, and can realize the measurement of 90 pieces of 4-12 wafers per hour in the case of low cost.UltraMap UMA- 300-wl USES the MicroSense double-sided white probe to measure the wafer thickness, TTV,bow, warp, and LTV.
Wafer 4”to 12”(100 to 300mm)
Thickness range: 50um to 3mm
Extended warpage range up to 5mm
Throughput up to 120 wafers / hour
2D & 3D mapping capability
Full SECS/GEM compatibility
Automated calibration
