Accurately and quickly check the entire substrate
Model Stealth300V uses a linear LED light source to irradiate the substrate/film surface and an ultra-high-sensitivity camera to scan the positive and negative/scattered light from the sample. The machine capture the entire image and detect the defects on the surface through image analysis.
Compared to previous local inspection equipment, Stealth can detect various surface defects more quickly and comprehensively. This machine is suitable for quality inspection of various films after various process stages, such as exposure MURA, photoresist, PI film, residue MURA, etc.. In addition, the machine can measure the height of the Micro Lens and LED PSS.
Test object: Photoresist MURA
Print residual film MURA
LED PSS height MURA
Color Filter MURA, etc.
Wafer size: 2-12” Wafer
Camera: Linear Sensor Camera
Light source: LED
Inspection method: Detection with two methods: reflection/scattering
Measurement time: 1 sample /1 minute (excluding image analysis time)
Red, blue, and white light can be used
Supports SEMI 150-300mm wafers, FPD G10.5 or less, or LED 50-150mm chips
The smallest detectable particle size 28um
