The FilmTek™ 4000 metrology system offers fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. This system offers several advances designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.Utilizing multi-angle reflectometry and patented multi-angle Differential Power Spectral Density analysis capability, the FilmTek™ 4000 delivers unmatched measurement accuracy required to meet waveguide manufacturing specifications. Measurement resolution is optimized through independent thickness and index (TE and TM modes) measurements of each cladding and core layer, with index measurement resolution up to 2×10-5. This provides a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems.
Film thickness range: 0Å to 250µm (with SE option)
Film thickness accuracy: ±1.5Å for NIST traceable standard oxide 5000Å to 1µm
Precision (1σ): 5µm Oxide (t,n): 2Å / 0.00002
Spectral range: 380nm to 1700nm (380nm to 1000nm is standard)
Measurement spot size: 1mm (normal incidence); 2mm (70°)
Spectral resolution: Visible: 0.3nm / NIR: 2nm
Light source: Regulated halogen lamp (10,000 hrs lifetime)
Detector type: 2048 pixel Sony linear CCD array / 512 pixel cooled Hamamatsu InGaAs CCD array (NIR)
Automated Stage: 150mm to 300mm (200mm is standard)
Computer: Multi-core processor with Windows™ 7 Operating System
Measurement time: <5 sec per site (e.g., oxide film)
