The UltraMap 200B Wafer measurement system is a benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm.
Dual white light chromatic coding probe technology with 10nm resolution
Thickness range from 50um to 1mm
Automated calibration
Hiscan option for surface roughness and link profile measurement and other surface structures
