The UltraMap 300-IR full automation including robotic loading and 6 cassettes for binning.A convenient benchtop version, the UltraMap UMS-300IR, is also available.Thickness and shape measurement of wafers with backgrinding tape wafer on sawframe, dies on tape, wafer on bumps, SOI, multiple layers, bonded wafers, thickness of Si, plastic, glass, adhesive layers.
0.5um accuracy
0.1um resolution
Wafer 4" to 12" (100 to 300mm) round or square
Thickness range: 20um to 1mm
Flexible recipe generation
2D & 3D mapping capability
SECS/GEM communication
